![](/img/cover-not-exists.png)
[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Examination of residual stress measurement in electronic packages using phase-shifted sampling moiré method and X-ray images
Koganemaru, Masaaki, Uchino, Masakazu, Ikeda, Akihiro, Asano, TanemasaYear:
2014
Language:
english
DOI:
10.1109/ESTC.2014.6962827
File:
PDF, 2.17 MB
english, 2014