Interfacial Reaction of W/Cu Examined by an n-body...

Japanese Journal of Applied Physics 2002 / 7 Vol. 41; Iss. Part 1, No

Interfacial Reaction of W/Cu Examined by an n-body Potential through Molecular Dynamics Simulations

Kong, Ling Ti, Li, Xin Yu, Lai, Wen Sheng, Liu, Jian Bo, Liu, Bai Xin
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
41
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.41.4503
Date:
July, 2002
File:
PDF, 682 KB
english, 2002
Conversion to is in progress
Conversion to is failed