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Finite element modeling of microscale thermal residual stresses in Al interconnects
Saerens, A., Van Houtte, P., Kalidindi, S. R.Volume:
16
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/JMR.2001.0154
Date:
April, 2001
File:
PDF, 869 KB
english, 2001