[IEEE 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2014) - Des Moines, IA, USA (2014.10.19-2014.10.22)] 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) - The influences of proportion of flexible epoxy resin on dielectric properties
Feng, Hua, Peng, Zong-ren, Ning, Xin, Wang, Jia-long, Liu, Peng, Guo, Zi-haoYear:
2014
Language:
english
DOI:
10.1109/ceidp.2014.6995837
File:
PDF, 1.12 MB
english, 2014