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[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - High reliability packaging technologies and process for ultra low k Flip Chip devices
Park, Joonyoung, Kim, YunHee, Na, SeokHo, Kim, JinYoung, Lee, ChoonHeung, Nicholls, LouYear:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159562
File:
PDF, 1.08 MB
english, 2015