[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Failure mechanism and microstructural evolution of Pb-free solder alloys in thermal cycling tests: Effect of solder composition and Sn grain morphology
Arfaei, Babak, Mutuku, Francis, Coyle, Richard, Cotts, Eric, Wilcox, JimYear:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159580
File:
PDF, 1.87 MB
english, 2015