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[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Technology of packaging by Liquid Mold-Underfill (MUF) material for advanced mobile devices
Ishikawa, Yuki, Yukimaru, Joji, Takao, Tomoya, Ikeda, Kazuhiro, Yamane, Kazuaki, Nakao, Akira, Hisanaga, NaokatsuYear:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159588
File:
PDF, 978 KB
english, 2015