[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Stress and bowing engineering in passive silicon interposer
Detalle, Mikael, Vandevelde, B., Nolmans, P., Miller, A., La Manna, A., Beyer, G., Beyne, E.Year:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159606
File:
PDF, 1.62 MB
english, 2015