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[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates
Sakuma, Katsuyuki, Tunga, Krishna, Webb, Buck, Ramachandran, Koushik, Interrante, Marcus, Liu, Hsichang, Angyal, Matthew, Berger, Daniel, Knickerbocker, John, Iyer, SubramanianYear:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159611
File:
PDF, 1.95 MB
english, 2015