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[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Effects of packaging on mechanical stress in 3D-ICs
Cherman, V., Lofrano, M., Simons, V., Gonzalez, M., Van der Plas, G., De Vos, J., Wang, T., Daily, R., Salahouelhadj, A., Beyer, G., La Manna, A., De Wolf, I., Beyne, E.Year:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159617
File:
PDF, 2.10 MB
english, 2015