[IEEE 2015 IEEE 65th Electronic Components and Technology...

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[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Effects of packaging on mechanical stress in 3D-ICs

Cherman, V., Lofrano, M., Simons, V., Gonzalez, M., Van der Plas, G., De Vos, J., Wang, T., Daily, R., Salahouelhadj, A., Beyer, G., La Manna, A., De Wolf, I., Beyne, E.
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Year:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159617
File:
PDF, 2.10 MB
english, 2015
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