![](/img/cover-not-exists.png)
[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - The mechanism and kinetic study of void migration in Cu vias under current flow by 3D X-ray computed tomography
Li, Yan, Xu, Luhua, Liu, Pilin, Pathangey, Balu, Pacheco, Mario, Hossain, Mohammad, Hu, Liang, Dias, Rajen, Goyal, DeepakYear:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159628
File:
PDF, 985 KB
english, 2015