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[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - A high throughput and reliable thermal compression bonding process for advanced interconnections
Li, Ming, Tian, DeWen, Cheung, YiuMing, Yang, Lei, Lau, John H.Year:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159653
File:
PDF, 1.31 MB
english, 2015