[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - FC Cu pillar package development for broad market applications
Cheng, Robert, Wang, Mark, Kuo, Roger HO, Chen, Elson, Chuang, IC, Pai, Benjamin, Chang, Jenny, Cheung, CalvinYear:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159654
File:
PDF, 2.24 MB
english, 2015