[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Hybrid integration and packaging of an energy-efficient WDM silicon photonic chip-to-chip interconnect
Thacker, Hiren D., Shafiiha, Roshanak, Lexau, Jon, Zheng, Xuezhe, Djordjevic, Stevan S., Lin, Shiyun, Simons, John, Abed, Arin, Amberg, Phil, Chang, Eric, Shubin, Ivan, Lee, Jin-Hyoung, Luo, Ying, YaoYear:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159678
File:
PDF, 1.27 MB
english, 2015