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[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Advance semiconductor package applied on high efficiency dual-mode DC-DC buck converter
Ho, Cheng-Yu, Cheng, Hung-Hsiang, Chung, Ming-Feng, Wang, Chen-Chao, Yang, Cing-Wen, Wang, Hung-YuYear:
2015
Language:
english
DOI:
10.1109/ICEPT.2015.7236571
File:
PDF, 1.28 MB
english, 2015