![](/img/cover-not-exists.png)
[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Reliability of Pb-free solder joints in FCBGA using finite element simulation and Taguchi method
Zhang, Liang, Sun, Lei, Zhong, Su-juan, Ma, Jia, Bao, LiYear:
2015
Language:
english
DOI:
10.1109/ICEPT.2015.7236574
File:
PDF, 1.39 MB
english, 2015