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[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - The finite element simulation and nanoindentation methods for the study of mechanical behavior of lead-free solder joints
Wang, Lifeng, Zhou, Jia, Liu, Yingjie, Ge, Qi, Zhang, Yuanjian, Dai, WenqinYear:
2015
Language:
english
DOI:
10.1109/ICEPT.2015.7236582
File:
PDF, 1.82 MB
english, 2015