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[IEEE 2015 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2015.4.19-2015.4.23)] 2015 IEEE International Reliability Physics Symposium - Effects of copper CMP and post clean process on VRDB and TDDB at 28nm and advanced technology node
Hsu, Li Chieh, Lin, Yu Min, Wu, Chien Liang, Lee, Wei Kun, Liu, Yen Chun, Chiu, Cheng Pu, Hsu, Hsin Kuo, Wang, Chun Yi, Huang, Chien Chung, Lin, Chin FuYear:
2015
Language:
english
DOI:
10.1109/IRPS.2015.7112775
File:
PDF, 268 KB
english, 2015