Copper metallization in microelectronics using filtered...

Copper metallization in microelectronics using filtered vacuum arc deposition — principles and technological development

P Siemroth, T Schülke
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Volume:
133-134
Year:
2000
Language:
english
Pages:
8
DOI:
10.1016/s0257-8972(00)00883-5
File:
PDF, 363 KB
english, 2000
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