Experimental and numerical study of thermal enhancement in reentrant copper microchannels
Deng, Daxiang, Wan, Wei, Tang, Yong, Shao, Haoran, Huang, YueVolume:
91
Language:
english
Journal:
International Journal of Heat and Mass Transfer
DOI:
10.1016/j.ijheatmasstransfer.2015.08.025
Date:
December, 2015
File:
PDF, 4.70 MB
english, 2015