A chip-scale chemical mechanical planarization model for...

Microelectronic Engineering 2016 / 01 Vol. 149

A chip-scale chemical mechanical planarization model for copper interconnect structures

Xu, Qinzhi, Fang, Jingjing, Chen, Lan
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Volume:
149
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2015.08.012
Date:
January, 2016
File:
PDF, 3.56 MB
english, 2016
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