Preferentially oriented and amorphous Ti, TiN and Ti/TiN diffusion barrier for Cu prepared by ion beam assisted deposition (IBAD)
Kewei Chen, Yuhui Yu, Haichuan Mu, E.Z. Luo, B. Sundaravel, S.P. Wong, I.H. WilsonVolume:
151-152
Year:
2002
Language:
english
Pages:
6
DOI:
10.1016/s0257-8972(01)01588-2
File:
PDF, 135 KB
english, 2002