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[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Material development for 3D wafer bond and de-bonding process
Mori, Takashi, Yamaguchi, Torahiko, Maruyama, Yooichiroh, Hasegawa, Koichi, Kusumoto, ShiroYear:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159700
File:
PDF, 1.03 MB
english, 2015