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[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Nanoparticle assembly and sintering towards all-copper flip chip interconnects
Zurcher, Jonas, Yu, Kerry, Schlottig, Gerd, Baum, Mario, Taklo, Maaike M. Visser, Wunderle, Bernhard, Warszynski, Piotr, Brunschwiler, ThomasYear:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159734
File:
PDF, 1.49 MB
english, 2015