Impact of Copper Through-Package Vias on Thermal...

IEEE Transactions on Components Packaging and Manufacturing Technology 2015 / 8 Vol. 5; Iss. 8

Impact of Copper Through-Package Vias on Thermal Performance of Glass Interposers

Cho, Sangbeom, Sundaram, Venky, Tummala, Rao R., Joshi, Yogendra K.
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Volume:
5
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2015.2450731
Date:
August, 2015
File:
PDF, 2.48 MB
english, 2015
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