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[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Breakthrough development of ultimate ultra-fine pitch process with gold wire & copper wire in QFN packages
Tan, C. E., Liong, J. Y., Dimatira, Jeramie, Kok, Lee Wee, Tan, Jason, Wijaya, Lie Handra, Song, James, Satoshi, Teshima, Kwong, K. H.Year:
2014
Language:
english
DOI:
10.1109/eptc.2014.7028254
File:
PDF, 1.67 MB
english, 2014