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[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - How to improve void performance in wafer bumping
Ruifen, Zhang, Tat, Yap Kong, Huei, Yam Lip, Dexter, ReynosoYear:
2014
Language:
english
DOI:
10.1109/eptc.2014.7028257
File:
PDF, 475 KB
english, 2014