[IEEE 2014 IEEE 16th Electronics Packaging Technology...

  • Main
  • [IEEE 2014 IEEE 16th Electronics...

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Innovative wafer level package manufacturing with FlexLineTM

Chen, Kang, Lim, Kok Hwa, Seah, Kenneth, Lin, Yaojian, Yoon, Seung Wook
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2014
Language:
english
DOI:
10.1109/eptc.2014.7028268
File:
PDF, 379 KB
english, 2014
Conversion to is in progress
Conversion to is failed