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[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Innovative wafer level package manufacturing with FlexLineTM
Chen, Kang, Lim, Kok Hwa, Seah, Kenneth, Lin, Yaojian, Yoon, Seung WookYear:
2014
Language:
english
DOI:
10.1109/eptc.2014.7028268
File:
PDF, 379 KB
english, 2014