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[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - MoldFlow simulation study on void risk prediction for FCCSP with molded underfill technology
Yen, Freedman, Hung, Leo, Kao, Nicholas, Jiang, Don SonYear:
2014
Language:
english
DOI:
10.1109/eptc.2014.7028307
File:
PDF, 479 KB
english, 2014