![](/img/cover-not-exists.png)
[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Power noise isolation in a silicon interposer with through silicon vias
Kim, Myunghoi, Shin, Dong-Hwan, Um, Man-Seok, Yom, In-BokYear:
2014
Language:
english
DOI:
10.1109/eptc.2014.7028315
File:
PDF, 678 KB
english, 2014