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[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Power noise isolation in a silicon interposer with through silicon vias

Kim, Myunghoi, Shin, Dong-Hwan, Um, Man-Seok, Yom, In-Bok
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Year:
2014
Language:
english
DOI:
10.1109/eptc.2014.7028315
File:
PDF, 678 KB
english, 2014
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