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[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Joint strength and microstructures of brazed joints of stainless steel with Fe-based filler
Tsunoda, Takahiro, Shi, Kangdao, Shohji, Ikuo, Matsu, Kotaro, Taguchi, YasuhiroYear:
2014
Language:
english
DOI:
10.1109/eptc.2014.7028318
File:
PDF, 1.57 MB
english, 2014