[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Tensile properties of low-melting point Sn-Bi-Sb solder
Kubota, Yuto, Shohji, Ikuo, Tsuchida, Tetsuyuki, Nakamura, KiyotomoYear:
2014
Language:
english
DOI:
10.1109/eptc.2014.7028319
File:
PDF, 813 KB
english, 2014