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[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - The IMC formation and progress in the copper pillar Cu/Sn1.8Ag /OSP-Cu microbump structure upon current stressing
Chen, Chiao-Wen, Lin, Kwang-Lung, Chiu, Ying-Ta, Kao, Chin-Li, Lee, Chiu-Wen, Yang, Ping-FengYear:
2014
Language:
english
DOI:
10.1109/eptc.2014.7028325
File:
PDF, 370 KB
english, 2014