[IEEE 2014 IEEE 16th Electronics Packaging Technology...

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[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Gold-germanium laser jetting for high temperature (300°C) flip chip application

Yuan, Hwang How, Zhi, Ding Mian, Woo, Daniel Rhee Min
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Year:
2014
Language:
english
DOI:
10.1109/eptc.2014.7028365
File:
PDF, 2.03 MB
english, 2014
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