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[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Optimization of the wafer level molding process for high power device module
Bu, Lin, Ho, Siow Ling, Dexter Velez, Sorono, Woo, Daniel Rhee MinYear:
2014
Language:
english
DOI:
10.1109/eptc.2014.7028368
File:
PDF, 344 KB
english, 2014