[IEEE 2014 IEEE 16th Electronics Packaging Technology...

  • Main
  • [IEEE 2014 IEEE 16th Electronics...

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Optimization of the wafer level molding process for high power device module

Bu, Lin, Ho, Siow Ling, Dexter Velez, Sorono, Woo, Daniel Rhee Min
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2014
Language:
english
DOI:
10.1109/eptc.2014.7028368
File:
PDF, 344 KB
english, 2014
Conversion to is in progress
Conversion to is failed