[IEEE 2014 IEEE 16th Electronics Packaging Technology...

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[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Thermo-compression bonding for 2.5D fine pitch copper pillar bump interconnections on TSV interposer

Lim, Sharon Pei-Siang, Ding, Mian Zhi, Dexter Velez, Sorono, Cereno, Daniel Ismael, Lin, Jong Kai, Rao, Vempati Srinivasa
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Year:
2014
Language:
english
DOI:
10.1109/eptc.2014.7028375
File:
PDF, 810 KB
english, 2014
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