![](/img/cover-not-exists.png)
[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Thermo-compression bonding for 2.5D fine pitch copper pillar bump interconnections on TSV interposer
Lim, Sharon Pei-Siang, Ding, Mian Zhi, Dexter Velez, Sorono, Cereno, Daniel Ismael, Lin, Jong Kai, Rao, Vempati SrinivasaYear:
2014
Language:
english
DOI:
10.1109/eptc.2014.7028375
File:
PDF, 810 KB
english, 2014