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[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - High power SiC inverter module packaging solutions for junction temperature over 220°C
Woo, Daniel Rhee Min, Yuan, Hwang How, Li, Jerry Aw Jie, Ling, Ho Siow, Bum, Lee Jong, Songbai, ZhangYear:
2014
Language:
english
DOI:
10.1109/eptc.2014.7028383
File:
PDF, 600 KB
english, 2014