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[IEEE 2014 IEEE 9th Ibero-American Congress on Sensors (IBERSENSOR) - Bogota, Colombia (2014.10.15-2014.10.18)] 2014 IEEE 9th IberoAmerican Congress on Sensors - Gold ball bumping versus E-less Ni/Au remetallization for chemical sensor integration using lead-free soldering for flip chip assembly
Cardoso, Valtemar F, da Silva, Ana Neilde R., Rocha, Zaira M., Seabra, Antonio Carlos, Jimenez-Jorquera, Cecilia, Cadarso, AlfredoYear:
2014
Language:
english
DOI:
10.1109/ibersensor.2014.6995513
File:
PDF, 2.14 MB
english, 2014