[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - A TSV-less PoP packaging structure for high bandwidth memory
Hu, Dyi-Chung, Lin, Puru Bruce, Chen, Yu-HuaYear:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159698
File:
PDF, 1.09 MB
english, 2015