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[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - 0.35mm pitch wafer level package board level reliability: Studying effect of ball de-population with varying ball size
Keser, Beth, Alvarado, Rey, Schwarz, Mark, Bezuk, SteveYear:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159730
File:
PDF, 1.34 MB
english, 2015