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[IEEE 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD) - Hong Kong, China (2015.5.10-2015.5.14)] 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD) - Numerical study of GaN-on-Si HEMT breakdown instability accounting for substrate and packaging interactions
Monti, F., Imperiale, I., Reggiani, S., Gnani, E., Gnudi, A., Baccarani, G., Nguyen, L., Hernandez-Luna, A., Huckabee, J., Tipirneni, N., Denison, M.Year:
2015
Language:
english
DOI:
10.1109/ISPSD.2015.7123469
File:
PDF, 488 KB
english, 2015