[IEEE 2014 IEEE 36th International Electronics Manufacturing Technology Conference (IEMT) - Johor, Malaysia (2014.11.11-2014.11.13)] 36th International Electronics Manufacturing Technology Conference - Effect of microwave hybrid heating on the formation of intermetallic compound of Sn-Ag-Cu solder joints
Lutfi, Maisarah, Yusof, Farazila, Ramesh, S., Ariga, T., Hamdi, M.Year:
2014
Language:
english
DOI:
10.1109/IEMT.2014.7123094
File:
PDF, 3.20 MB
english, 2014