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[IEEE 2015 International Conference on IC Design & Technology (ICICDT) - Leuven, Belgium (2015.6.1-2015.6.3)] 2015 International Conference on IC Design & Technology (ICICDT) - Thermal experimental and modeling analysis of high power 3D packages

Oprins, H., Cherman, V., Van der Plas, G., Maggioni, F., De Vos, J., Beyne, E.
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Year:
2015
Language:
english
DOI:
10.1109/ICICDT.2015.7165906
File:
PDF, 1.86 MB
english, 2015
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