[IEEE 2014 IEEE 36th International Electronics Manufacturing Technology Conference (IEMT) - Johor, Malaysia (2014.11.11-2014.11.13)] 36th International Electronics Manufacturing Technology Conference - Packaging technology and design challenges for fine pitch Cu pillar and BOT (Bond on Trace) using thermal compression bonding
Lee, M J Myung-June, Lim, Chew Ching, Teh, Pheak TiYear:
2014
Language:
english
DOI:
10.1109/IEMT.2014.7123085
File:
PDF, 3.42 MB
english, 2014