Tetrazole Derived Levelers for Filling Electroplated Cu...

Electrochimica Acta 2015 / 10 Vol. 178

Tetrazole Derived Levelers for Filling Electroplated Cu Microvias: Electrochemical Behaviors and Quantum Calculations

Lei, Zhanwu, Chen, Long, Wang, Wenliang, Wang, Zenglin, Zhao, Chuan
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Volume:
178
Language:
english
Journal:
Electrochimica Acta
DOI:
10.1016/j.electacta.2015.08.037
Date:
October, 2015
File:
PDF, 2.92 MB
english, 2015
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