[IEEE 2015 16th International Conference on Thermal,...

[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Study on thermomechanical reliability of power modules and thermal grease pump-out mechanism

Jue Li,, Myllykoski, Pirkka, Paulasto-Krockel, Mervi

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Year:

2015

Language:

english

DOI:

10.1109/EuroSimE.2015.7103076

File:

PDF, 1.42 MB

english, 2015

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