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SPIE Proceedings [SPIE Integrated Optoelectronic Devices 2007 - San Jose, CA (Saturday 20 January 2007)] Photonics Packaging, Integration, and Interconnects VII - 3-D microoptic systems integration: advances in fabrication and packaging
Jahns, J., Bohling, M., Jarczynski, M., Seiler, Th., Earman, Allen M., Chen, Ray T.Volume:
6478
Year:
2007
Language:
english
DOI:
10.1117/12.714299
File:
PDF, 723 KB
english, 2007