Thermal Modeling of 3-D Stacked DRAM Over SiGe HBT BiCMOS...

IEEE Access 2015 Vol. 3

Thermal Modeling of 3-D Stacked DRAM Over SiGe HBT BiCMOS CPU

Clarke, Ryan, Jacob, Philip, Erdogan, Okan, Belemijian, Paul, Raman, Srikumar, Leroy, Mitchell R., Neogi, Tuhin Guha, Kraft, Russell P., Borca-Tasciuc, Diana-Andra, McDonald, John F.
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Volume:
3
Year:
2015
Language:
english
Journal:
IEEE Access
DOI:
10.1109/ACCESS.2015.2396474
File:
PDF, 14.76 MB
english, 2015
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