[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Study of gold wire bonding on 0.1 μm soft gold film substrate
Zhang, Ruonan, Guo, Rui, Li, Ming, Qian, Kaiyou, Chiu, HopeYear:
2014
Language:
english
DOI:
10.1109/ICEPT.2014.6922635
File:
PDF, 1.28 MB
english, 2014