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IEEE Transactions on Components Packaging and Manufacturing Technology 2015

Failure Analysis and Experimental Verification for Through-Silicon-via Underfill Dispensing on 3-D Chip Stack Package

Le, Fuliang, Lee, Shi-Wei Ricky, Lo, Jeffery C. C., Yang, Chaoran
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Year:
2015
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2015.2477075
File:
PDF, 4.03 MB
english, 2015
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